JPH072611Y2 - 鍍金用押圧板 - Google Patents
鍍金用押圧板Info
- Publication number
- JPH072611Y2 JPH072611Y2 JP624589U JP624589U JPH072611Y2 JP H072611 Y2 JPH072611 Y2 JP H072611Y2 JP 624589 U JP624589 U JP 624589U JP 624589 U JP624589 U JP 624589U JP H072611 Y2 JPH072611 Y2 JP H072611Y2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- lead frame
- mask
- pressing plate
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 title claims description 73
- 238000003780 insertion Methods 0.000 claims description 13
- 230000037431 insertion Effects 0.000 claims description 13
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000006835 compression Effects 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 239000007779 soft material Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 230000033001 locomotion Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP624589U JPH072611Y2 (ja) | 1989-01-23 | 1989-01-23 | 鍍金用押圧板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP624589U JPH072611Y2 (ja) | 1989-01-23 | 1989-01-23 | 鍍金用押圧板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0299969U JPH0299969U (en]) | 1990-08-09 |
JPH072611Y2 true JPH072611Y2 (ja) | 1995-01-25 |
Family
ID=31210317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP624589U Expired - Lifetime JPH072611Y2 (ja) | 1989-01-23 | 1989-01-23 | 鍍金用押圧板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH072611Y2 (en]) |
-
1989
- 1989-01-23 JP JP624589U patent/JPH072611Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0299969U (en]) | 1990-08-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5523696A (en) | Method and apparatus for testing integrated circuit chips | |
US3533155A (en) | Bonding with a compliant medium | |
US5672980A (en) | Method and apparatus for testing integrated circuit chips | |
JP2001303297A (ja) | 部分めっき装置 | |
US20040085742A1 (en) | Capacitor mounting structure | |
JPH072611Y2 (ja) | 鍍金用押圧板 | |
CN213305887U (zh) | 一种刷锡结构 | |
US5987742A (en) | Technique for attaching a stiffener to a flexible substrate | |
JPH0539630Y2 (en]) | ||
JPS60201696A (ja) | フラツトパツケ−ジの半田付方法 | |
CN215251295U (zh) | 一种pcb板电镀装置 | |
CN219811016U (zh) | 一种电路板加工测试治具 | |
KR101075661B1 (ko) | 마스크 지지장치 및 이를 구비한 인쇄회로기판용 인쇄장치 | |
JPS63138985A (ja) | 電子部品保持体 | |
JPH10130894A (ja) | 電子部品へのめっき治具およびめっき方法 | |
JP2522111B2 (ja) | リ―ドの半田メッキ装置 | |
JP2522110B2 (ja) | リ―ドの半田メッキ装置 | |
JPH04162759A (ja) | リードの半田メッキ装置 | |
JP2942401B2 (ja) | メッキ用治具 | |
JPS623585B2 (en]) | ||
JP2001024088A (ja) | プリント基板、及びプリント基板への部分メッキ方法 | |
JPS63140099A (ja) | めつき処理装置 | |
JP3167782B2 (ja) | 電子部品の高速半田めっき装置 | |
JPH05243465A (ja) | 半導体装置の実装方法 | |
JPS6281789A (ja) | 配線基板およびその製造方法ならびにその配線基板を組み込んだ電子部品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |